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| INTEGRATED CIRCUITS DATA SHEET TDA8003TS I2C-bus SIM card interface Product specification Supersedes data of 2000 Feb 29 File under Integrated Circuits, IC02 2000 Apr 20 Philips Semiconductors Product specification I2C-bus SIM card interface FEATURES * Subscriber Identification Module (SIM) card interface in accordance with GSM11.11, GSM11.12 (Global System for Mobile communication) and ISO 7816 requirements * VCC regulation (3 or 5 V 8%) with controlled rise and fall times * Card take-off protection * One protected and buffered pseudo-bidirectional I/O line (I/O referenced to VCC and SIMI/O referenced to VDDI) * Clock generation (up to 10 MHz) with synchronous start and frequency doubling * Clock stop LOW, clock stop HIGH or 1.25 MHz (from internal oscillator) for cards Power-down mode * Automatic activation and deactivation sequences of an independent sequencer * Automatic processing of pin RST with count of the CLK cycles for start of the Answer To Reset (ATR) * Warm reset command * Supply voltage supervisor for Power-on reset, spike killing and emergency deactivation in case of supply drop-out * DC-to-DC converter (doubler, tripler or follower) allowing operation in a 3 or 5 V environment (2.5 VDD 6 V) * Enhanced Electrostatic Discharge (ESD) protections on card side (6 kV minimum) * Power-down mode with several active features and current reduction * Off mode with 2 A current * Control from a microcontroller via a 400 kHz slave I2C-bus (4 possible addresses: 48H, 4AH, 4CH and 4EH) * Four parallel devices possible due to 2 sub-address wires * Interface signals supplied by an independent voltage (1.5 VDDI 6 V). ORDERING INFORMATION TYPE NUMBER TDA8003TS/C1 TDA8003TS/C2 PACKAGE NAME SSOP24 SSOP24 DESCRIPTION APPLICATIONS * GSM mobile phones TDA8003TS * SAM interfaces in banking terminals * Portable card readers, etc. GENERAL DESCRIPTION The TDA8003TS is a low cost one chip SIM interface, in accordance with GSM11.11, GSM11.12 and EMV96 (Europay, Mastercard, Visa) with card current limitation. Controlled by I2C-bus, it is optimized in terms of board space, external components count and connection count (see Chapter "Application information"). The integrated DC-to-DC converter ensures full cross-compatibility between 3 or 5 V cards and 3 or 5 V environments. The very low-power consumption in Power-down mode and Off mode saves battery power. VERSION SOT340-1 SOT340-1 plastic shrink small outline package; 24 leads; body width 5.3 mm plastic shrink small outline package; 24 leads; body width 5.3 mm 2000 Apr 20 2 Philips Semiconductors Product specification I2C-bus SIM card interface QUICK REFERENCE DATA SYMBOL VDD IDD PARAMETER supply voltage on pins VDDS and VDDP supply current on pins VDDS and VDDP Off mode; VDD = 3 V Power-down mode; VDD = 3 V; VCC = 5 V; ICC = 100 A; SIMCLK connected to PGND or VDDI; CLK is stopped active mode; VDD = 3 V; VCC = 3 V; ICC = 6 mA; fCLK = 3.25 MHz active mode; VDD = 3 V; VCC = 5 V; ICC = 10 mA; fCLK = 3.25 MHz active mode; VDD = 5 V; VCC = 3 V; ICC = 6 mA; fCLK = 3.25 MHz active mode; VDD = 5 V; VCC = 5 V; ICC = 10 mA; fCLK = 3.25 MHz VDDI VCC interface signal supply voltage card supply voltage 5 V card; active mode; 0 < ICC < 15 mA; 40 nAs dynamic load on 200 nF capacitor 3 V card; active mode; 0 < ICC < 10 mA; 24 nAs dynamic load on 200 nF capacitor CONDITIONS MIN. 2.5 - - TDA8003TS TYP. - - - MAX. 6 2 500 UNIT V A A - - - - 1.5 4.6 - - - - - 5 18 50 10 30 6 5.4 mA mA mA mA V V 2.75 3 3.25 V 5 V card; bit PDOWN = 1; ICC < 5 mA 4.6 3 V card; bit PDOWN = 1; ICC < 5 mA 2.75 SR tde tact fi(SIMCLK) Tamb slew rate on VCC (rise and fall) deactivation time activation time clock input frequency operating ambient temperature CL(max) = 200 nF 0.05 - - 0 -40 - - - - - - - 5.4 3.25 0.25 120 150 20 +85 V V V/s s s MHz C 2000 Apr 20 3 Philips Semiconductors Product specification I2C-bus SIM card interface BLOCK DIAGRAM TDA8003TS handbook, full pagewidth VDDP 100 nF S3 4 VUP 8 100 nF PGND 3 S4 6 100 nF S1 2 S2 7 5 2.2 F VDDS 100 nF 14 21 DC-TO-DC CONVERTER VOLTAGE SUPERVISOR SIMERR DEL 10 nF 15 TDA8003TS SEQUENCER VCC 200 nF 12 18 VDDI 23 RST 13 INTERNAL OSCILLATOR I2C-BUS INTERFACE AND REGISTERS 22 19 20 1 17 SAD1 SAD0 SDA SCL PWROFF SIMI/O I/O 9 ANALOG DRIVERS AND PROTECTIONS CLK 11 CLOCK COUNTER 16 24 PRES CLOCK CIRCUITRY 10 SIMCLK MGR434 SGND Fig.1 Block diagram. 2000 Apr 20 4 Philips Semiconductors Product specification I2C-bus SIM card interface PINNING SYMBOL PWROFF S1 PGND S3 VDDP S4 S2 VUP I/O SGND CLK VCC RST VDDS DEL PRES SIMI/O VDDI SDA SCL SIMERR SAD0 SAD1 SIMCLK Note PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 DESCRIPTION control input for entering the Off mode (active LOW) capacitor connection for the DC-to-DC converter (between S1 and S2) power ground capacitor connection for the DC-to-DC converter (between S3 and S4) power supply voltage capacitor connection for the DC-to-DC converter (between S3 and S4) capacitor connection for the DC-to-DC converter (between S1 and S2) DC-to-DC converter output (must be decoupled with 100 nF to ground) input/output to and from the card reader (C7I); see Fig.7 signal ground clock output to the card reader (C3I) supply voltage to the card reader (C1I) reset output to the card reader (C2I) signal supply voltage external capacitor connection for the delay on voltage supervisor card presence indication input (active LOW); note 1 TDA8003TS input/output to and from the microcontroller (internal 20 k pull-up resistor connected to VDDI) supply voltage for the interface signals with the system I2C-bus serial data input/output I2C-bus serial clock input interrupt output (active LOW; internal 100 k pull-up resistor connected to VDDI) I2C-bus slave address selection input I2C-bus slave address selection input external clock input 1. Card presence input with negative current source. To be used with the card reader switch connected to VDDS or VDDP. The switch is normally closed when the card is not present. If the switch connection is open-circuit or pin 16 is not connected, then the interface will always detect a present card (see Fig.7). 2000 Apr 20 5 Philips Semiconductors Product specification I2C-bus SIM card interface TDA8003TS handbook, halfpage PWROFF 1 S1 2 PGND 3 S3 4 VDDP 5 S4 6 24 SIMCLK 23 SAD1 22 SAD0 21 SIMERR 20 SCL 19 SDA TDA8003TS S2 7 VUP 8 I/O 9 SGND 10 CLK 11 VCC 12 MGR435 18 VDDI 17 SIMI/O 16 PRES 15 DEL 14 VDDS 13 RST Fig.2 Pin configuration. FUNCTIONAL DESCRIPTION Figure 1 shows the block diagram of the TDA8003TS. The functional blocks are described in the following sections. It is assumed that the reader of this specification is aware of GSM11.11 and ISO 7816 terminology. I2C-bus control The structure of the I2C-bus data frames is as follows: * Commands to the TDA8003TS: - START/ADDRESS/WRITE - COMMAND BYTE - STOP. The fixed address is 01001XY. X and Y are defined by the logic levels on pins SAD1 and SAD0 as shown in Table 1 (connect to ground for logic 0; connect to VDDI for logic 1). The command bits are described in Table 2. The commands are executed on the rising edge of the 9th SCL pulse. * Status from the TDA8003TS (see Table 4). The fixed address is 01001XY. X and Y are defined by the logic levels on pins SAD1 and SAD0 as shown in Table 1. Table 1 Address selections SAD1 0 0 1 1 SAD0 0 1 0 1 The I2C-bus interface is used: * To configure the clock to the card in active mode (12fSIMCLK and 14fSIMCLK) * To configure the clock to the card in power reduction mode (stop LOW, stop HIGH or 1.25 MHz derived from the internal oscillator) * To select operation with a 3 or 5 V card * To start or stop sessions (cold reset) * To initiate a warm reset * To enter or leave the Power-down mode * To request the status (card present or not, hardware problem occurred, unresponsive card after activation, supply drop-out detected by the voltage supervisor, card powered or not) * To configure SIMI/O and I/O in high-impedance (for use of several TDA8003TS in parallel). 2000 Apr 20 6 ADDRESS 48H 4AH 4CH 4EH Philips Semiconductors Product specification I2C-bus SIM card interface Table 2 Description of the command bits; (all bits are cleared at reset) BIT 0 1 DESCRIPTION TDA8003TS SYMBOL START/STOP WARM Logic 1 initiates an activation sequence and a cold reset procedure. Logic 0 initiates a deactivation sequence. Logic 1 initiates a warm reset procedure. TDA8003TS/C1: warm reset performed only when the 2 times 45000 CLK pulses have expired without answer from the card. TDA8003TS/C2: warm reset performed whatever the card has answered or not at the cold reset procedure but the count is 2 times 44745 CLK pulses. 3 V/5 VN PDOWN CLKPD1 CLKPD2 DT/DFN I/OEN Table 3 2 3 4 5 6 7 Logic 1 sets the card supply voltage VCC to 3 V. Logic 0 sets VCC to 5 V. Logic 1 applies on CLK the frequency defined by bits CLKPD1 and CLKPD2, and enters a reduced consumption mode. Logic 0 sets the circuit back to normal mode. Bits 4 and 5 determine the clock to the card at power-down as shown in Table 3. Logic 1 sets fCLK to 12fSIMCLK (in active mode). Logic 0 sets fCLK to 14fSIMCLK. Logic 1 will transfer I/O to SIMI/O. Logic 0 sets I/O and SIMI/O to high-impedance. Clock to the card at power-down BIT 5 0 1 0 1 clock stop LOW clock stop HIGH clock is 12fosc no change FUNCTION BIT 4 0 0 1 1 Table 4 Description of the status bits; note 1 BIT 0 1 2 3 4 5 DESCRIPTION Logic 1 when the card is present. Logic 0 when the card is not present. Logic 1 when the card has been extracted or inserted. Logic 0 when the status is read-out. Bit 2 is not used and is fixed to logic 0. Logic 1 when the voltage supervisor has signalled a fault. Logic 0 when the status is read-out. Logic 1 when an overload has occurred during a session. Logic 0 when the status is read-out. TDA8003TS/C1: Logic 1 when a card has not answered after 2 times 45000 CLK pulses. Logic 0 when the status is read-out. TDA8003TS/C2: Same as for C1, but the count is 2 times 44745 CLK pulses. Logic 1 when a card has answered between 200 and 352 CLK cycles. Logic 0 when the status is read-out. Logic 1 when the card is power-on. Logic 0 when the card is power-off. SYMBOL PRES PRESL - SUPL PROT MUTE EARLY ACTIVE Note 6 7 1. In case of card extraction, supply drop-out or overload detection within a session, the card will be automatically deactivated, SIMERR pulled LOW, bit START = 0 and the corresponding status bit = 1. The status bit will be logic 0 and SIMERR will be released when the microcontroller reads out the status register, on the 7th SCL pulse. After a supply drop-out, SIMERR will be released at the end of the alarm pulse and bit SUPL = 1. 2000 Apr 20 7 Philips Semiconductors Product specification I2C-bus SIM card interface Power supply The circuit operates within a supply voltage range of 2.5 to 6 V. The supply pins are VDDS and SGND. Pins VDDP and PGND only supply the DC-to-DC converter for the analog drivers to the card and must be decoupled externally because of the large current spikes that the card and the DC-to-DC converter can create. An integrated spike killer ensures the card contacts to remain inactive during power-up or power-down. An internal voltage reference is generated for the DC-to-DC converter, the voltage supervisor and the VCC generator. All interface signals with the microcontroller (PWROFF, SIMCLK, SAD1, SAD0, SIMERR, SCL, SDA and SIMI/O) are referenced to a separate supply pin VDDI, which may be different from VDD (1.5 VDDI 6 V). The pull-up resistors on bus lines SDA and SCL may be referenced to a voltage higher than VDDI. This allows the use of peripherals which do not operate at VDDI. TDA8003TS The voltage supervisor (see Fig.3) senses VDDS. It generates an alarm pulse, whose length tW is defined by an external capacitor connected to pin DEL, when VDD is too low to ensure proper operation (1 ms per 1 nF typical). During this alarm pulse, SIMERR is LOW and the I2C-bus is unresponsive. SIMERR goes back to HIGH, and the I2C-bus becomes operational at the end of this alarm pulse. Bit SUPL is set as long as the status has not been read. It is also used to either block any spurious signals on card contacts during microcontroller reset, or to force an automatic deactivation of the contacts in the event of supply drop-out. Outside a card session, SIMERR is LOW as long as the voltage supervisor is active. If a supply drop-out occurs during a session, SIMERR falls to LOW, bit START is cleared and an automatic deactivation is initiated. handbook, full pagewidth VDDS DEL tW SIMERR status read after event I2C-bus unresponsive I2C-bus OK I2C-bus unresponsive I2C-bus OK I2C-bus unresponsive MGR436 tW Fig.3 Voltage supervisor. 2000 Apr 20 8 Philips Semiconductors Product specification I2C-bus SIM card interface DC-to-DC converter The whole circuit is powered by VDDS, except for the VCC generator, the other card contact buffers and the interface signals. The DC-to-DC converter acts as a doubler or a tripler, depending on the supply voltage VDD and the card supply voltage VCC. There are basically four possible situations: * VDD = 3 V and VCC = 3 V. The DC-to-DC converter acts as a doubler with a regulation of VVUP at approximately 4.5 V * VDD = 3 V and VCC = 5 V. The DC-to-DC converter acts as a tripler with a regulation of VVUP at approximately 6.5 V * VDD = 5 V and VCC = 3 V. The DC-to-DC converter is disabled and VDD is applied to pin VUP * VDD = 5 V and VCC = 5 V. The DC-to-DC converter acts as a doubler with a regulation of VVUP at approximately 6.5 V. The supply voltage is recognized by the TDA8003TS at approximately 3.75 V for the C1 and 3.3 V for the C2. When a card session is requested by the microcontroller, the sequencer will first start the DC-to-DC converter, which is a switched capacitor type, clocked by an internal oscillator at a frequency fosc of approximately 2.5 MHz. The output voltage VVUP is regulated at approximately 4.5 or 6.5 V and subsequently fed to the VCC generator. VCC and PGND are used as a reference for all other card contacts. Power-down mode The Power-down mode is used for current consumption reduction when the card is in Sleep mode. To enter Power-down mode, the microcontroller must first select CLK in this mode (stop LOW, stop HIGH or 1.25 MHz from the internal oscillator) with bits CLKPD1 and CLKPD2. Subsequently, the microcontroller sends the command PDOWN, CLK is switched to the value predefined by bits CLKPD1 and CLKPD2, and SIMCLK may be stopped (HIGH or LOW). If the selected CLK is stopped, the biasing currents in the buffers to the card will be reduced. The voltage supervisor and all control functions also remain active. The maximum current taken by the card in this mode when CLK is stopped is assumed to be less than 5 mA. Before leaving the Power-down mode, the clock signal must first be applied to SIMCLK, and then bit PDOWN must be set to logic 0. Off mode TDA8003TS The Off mode is entered when the PWROFF signal is LOW. In this mode, no function is valid. This mode avoids switching off the power supply of the device, and gives a current consumption less than 2 A. Before entering the Off mode, the card must be deactivated. The Off mode is resumed when the PWROFF signal returns to HIGH. This re-initializes the voltage supervisor, and has the same effect as a reset of the device. As long as the device is not ready to operate, the SIMERR signal will remain LOW. Sequencer and clock counter The sequencer handles the ensuring activation and deactivation sequences in accordance with GSM11.11 and ISO 7816, even in case of emergency (card take-off, short circuit and supply drop-out). The sequencer is clocked with the internal oscillator frequency fosc. The activation is initiated with the START command (only if the card is present, and if the voltage supervisor does not detect a fault on the supply). During activation, VCC goes HIGH and subsequently I/O is enabled and CLK is started with RST = LOW. The clock counter counts the CLK pulses till a start bit is detected on I/O. After 45000 CLK pulses for the C1 (44745 for the C2), if no start bit on I/O has been detected, the sequencer toggles RST to HIGH, and counts again 45000 CLK pulses (44745 for the C2). If, again, no start bit has been detected, SIMERR will be pulled LOW and the information of bit MUTE is set in the status register. If a start bit has been detected during the two 45000 CLK pulse slots (44745 for the C2), the clock counter is stopped, RST is kept at the same level and the session can go on between the card and the system. The clock counter does not take care of any start bit during the 200 first CLK pulses of both slots; if a start bit is detected between 200 and 352 CLK pulses of both slots, then SIMERR will be pulled LOW and the information of bit EARLY is set in the status register. The deactivation is initiated either by the microcontroller (STOP command), or automatically by the TDA8003TS in case of card take-off, short circuit or supply voltage drop-out detected by the voltage supervisor. During deactivation, RST will go LOW, CLK is stopped, I/O is disabled and VCC goes LOW. 2000 Apr 20 9 Philips Semiconductors Product specification I2C-bus SIM card interface Clock circuit The clock to the card is either derived from pin SIMCLK (2 to 20 MHz) or from the internal oscillator. During a card session, fCLK may be chosen to be 1 f 1 2 SIMCLK or 4fSIMCLK depending on bit DT/DFN. For the card Sleep mode, CLK may be chosen stop LOW, stop HIGH or 12fosc (1.25 MHz) with bits CLKPD1 and CLKPD2. This predefined value will be applied to CLK when bit PDOWN is set to logic 1. The first CLK pulse has the correct width, and all frequency changes are synchronous, ensuring that no pulse is smaller than 45% of the shortest period. The duty cycle is within 45 and 55% in stable state, the rise and fall times are less than 8% of the period and precaution has been taken so that there is no overshoot or undershoot. Activation sequence Figure 4 shows the activation sequence. When the card is inactive, VCC, CLK, RST and I/O are LOW, with low-impedance with respect to ground. The DC-to-DC converter is stopped. SIMI/O is pulled HIGH at VDDI via the 20 k pull-up resistor. When all conditions are met (supply voltage, card present, no hardware problems), the microcontroller may initiate an activation sequence by setting bit START to logic 1 (t0) via the I2C-bus: 1. The DC-to-DC converter is started (t1). 2. VCC starts rising from 0 to 3 or to 5 V according to 3 V/5 VN control bit with a controlled rise time of 0.17 V/s typically (t2). 3. I/O buffer is enabled in reception mode (t3). 4. CLK is sent to the card reader with RST = LOW, and the count of 45000 (44745 for C2) CLK pulses is started (t4 = tact). 5. If a start bit is detected on I/O, the clock counter is stopped with RST = LOW. If not, RST = HIGH, and a new count of 45000 (44745 for C2) CLK pulses is started (t5). TDA8003TS If a start bit is detected on I/O and the clock counter is stopped with RST = HIGH, the card session may continue. If not, bit MUTE is set in the status register and SIMERR is pulled LOW. The microcontroller may initiate a deactivation sequence by setting bit START to logic 0. If a start bit is detected during the 200 first CLK pulses of each count slot, then it will not be taken into account. If a start bit is detected during 200 and 352 CLK pulses of each slot, then bit EARLY is set in the status register and SIMERR is pulled LOW. The microcontroller may initiate a deactivation sequence by setting bit START to logic 0. The sequencer is clocked by 164fosc which leads to a time interval T of 25 s typically. Thus t1 = 0 to 164T; t2 = t1 + 32T; t3 = t1 + 72T; t4 = t1 + 4T and t5 depends on the SIMCLK frequency. Deactivation sequence Figure 5 shows the deactivation sequence. When the session is completed, the microcontroller sets bit START to logic 0. The circuit will execute an automatic deactivation sequence: 1. Card reset, RST falls to LOW (t10). 2. CLK is stopped (t11). 3. I/O falls to LOW (t12). 4. VCC falls to 0 V with typically 0.17 V/s slew rate (t13). The deactivation is completed when VCC reaches 0.4 V (tde). 5. The DC-to-DC converter is stopped and CLK, RST, VCC and I/O become low-impedance with respect to PGND (t14). Where t10 < 164T; t11 = t10 + 12T; t12 = t10 + T; t13 = t12 + 5 s and t14 = t10 + 4T. 2000 Apr 20 10 Philips Semiconductors Product specification I2C-bus SIM card interface TDA8003TS handbook, full pagewidth START VCC I/O CLK , t0, t1 t2 t3 t4 (= tact) the 200 first CLK pulses are masked , MGR437 RST SIMI/O t5 Answer To Reset (ATR) begin Fig.4 Activation sequence. handbook, full pagewidth START RST CLK I/O VCC MGR438 t10 t11 t12 t13 tde t14 Fig.5 Deactivation sequence. 2000 Apr 20 11 Philips Semiconductors Product specification I2C-bus SIM card interface Protections The following main hardware fault conditions are monitored by the circuit: * Short circuits between VCC and other contacts * Card take-off during transaction * Supply drop-out. When one of these problems is detected during a card session, the security logic block pulls SIMERR to LOW, to warn the microcontroller and initiates an automatic deactivation of the contacts (see Fig.6). I/O circuit The Idle state is realized by both I/O and SIMI/O being pulled HIGH (via a 10 k pull-up resistor from I/O to VCC and via a 20 k pull-up resistor from SIMI/O to VDDI). I/O is referenced to VCC and SIMI/O to VDDI, thus allowing operation with VCC VDD VDDI. TDA8003TS When configuration bit I/OEN is logic 0, then I/O and SIMI/O are independent, which allows parallelization of several TDA8003TS with only one I/O line on the microcontroller side (up to 4 different I2C-bus addresses). When bit I/OEN is logic 1, then the data transmission between I/O and SIMI/O is enabled. The first side on which a falling edge occurs becomes the master. An anti-latch circuit disables the detection of falling edges on the other side, which becomes a slave. After a delay time td (<500 ns) on the falling edge, the N transistor on the slave side is turned on, thus transmitting the logic 0 present on the master side. When the master goes back to logic 1, the P transistor on the slave side is turned on during td, and then both sides return to their Idle states. The maximum frequency on these lines is 1 MHz. handbook, full pagewidth START status readout SIMERR RST CLK I/O VCC MGR439 Fig.6 Emergency deactivation. 2000 Apr 20 12 Philips Semiconductors Product specification I2C-bus SIM card interface LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VDDP VDDS VDDI Vi(n) PARAMETER power supply voltage signal supply voltage interface signal supply voltage input voltage on pins 1, 17, 21 and 24 on pins 15, 16, 22 and 23 on pins 19 and 20 on pins 9, 11 and 13 on pin 12 on pin 8 on pins 2, 4, 6 and 7 Ii(n) DC input current on pins 1, 17, 19, 20, 21, 22, 23 and 24 on pin 15 Ii/o(n) DC input/output current on pins 2, 4, 6, 7 and 8 on pin 16 Ii/o(17) Ptot Tj Tstg Vesd(n) transient input/output current on pin 17 continuous total power dissipation operating junction temperature IC storage temperature electrostatic discharge voltage on pins 9, 11, 12, 13 and 16 on any other pin HANDLING -6 -2 +6 +2 duration 1 ms Tamb = -40 to +85 C -40 -5 -40 - - -55 -5 -5 +5 -0.5 -0.5 -0.5 -0.5 -0.5 -0.5 -0.5 CONDITIONS MIN. -0.5 -0.5 -0.5 TDA8003TS MAX. +6.5 +6.5 +6.5 +6.5 +6.5 VCC + 0.5 +6.5 +7.5 V V V V V V V V UNIT VDDS + 0.5 V VVUP + 0.5 V mA mA mA mA mA mW C C kV kV +10 +40 +5 +40 230 125 +150 Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handle Metal Oxide Semiconductor (MOS) devices. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS VALUE 102 UNIT K/W thermal resistance from junction to ambient in free air 2000 Apr 20 13 Philips Semiconductors Product specification I2C-bus SIM card interface TDA8003TS CHARACTERISTICS VDD = 3 V; VDDI = 1.5 V; fSIMCLK = 13 MHz; fCLK = 3.25 MHz; Tamb = 25 C; unless otherwise specified. SYMBOL Supplies VDD IDD supply voltage on pins VDDS and VDDP supply current on pins VDDS and VDDP Off mode inactive mode Power-down mode; VCC = 5 V; ICC = 100 A; SIMCLK connected to SGND or VDDI; CLK is stopped active mode; VCC = 5 V; ICC = 10 mA active mode; VDD = 5 V; VCC = 3 V; ICC = 6 mA active mode; VDD = 5 V; VCC = 5 V; ICC = 10 mA VDDI IDDI interface signal supply voltage interface signals supply current threshold voltage on VDD hysteresis voltage on Vth(VDD) threshold voltage on pin DEL voltage on pin DEL charge current on pin DEL discharge current on pin DEL alarm pulse width VDEL = VDD CDEL = 10 nF SIMCLK connected to PGND or VDDI fSIMCLK = 13 MHz; VDDI = 1.5 V Vth(VDD) Vhys Vth(DEL) VDEL Ich(DEL) Idch(DEL) tW fi(SIMCLK) tf tr VIL VIH IL 1 2fosc PARAMETER CONDITIONS MIN. TYP. - - - - MAX. UNIT 2.5 - - - 6.0 2 50 500 V A A A active mode; VCC = 3 V; ICC = 6 mA - - - - 1.5 - - 2 40 - - -0.5 0.5 15 - - - - - - - - - 1.38 - -1 - - - - - - - - - 6.0 4.5 18 50 10 30 6 2 120 2.3 200 - VDD -2.5 - 25 mA mA mA mA V A A V mV V V A mA ms falling edge Pin SIMCLK clock input frequency fall time rise time LOW-level input voltage HIGH-level input voltage leakage current 0 - - 0 0.7VDDI - 1 5 V card 3 V card - - 20 1 1 0.3VDDI 3 1.6 - - MHz s s V A MHz V V VDDI + 0.3 V DC-to-DC converter oscillator frequency voltage on pin VUP VVUP 2000 Apr 20 14 Philips Semiconductors Product specification I2C-bus SIM card interface TDA8003TS SYMBOL PARAMETER CONDITIONS MIN. -0.3 0.7VDDI - TYP. - - - - - - - - - - - - - - - - - - - - - - - - - - - - MAX. UNIT Pin SDA (open-drain) VIL VIH ILH IIL VOL VIL VIH ILI LOW-level input voltage HIGH-level input voltage HIGH-level leakage current LOW-level input current LOW-level output voltage depends on the pull-up resistor IOL = 3 mA +0.3VDDI 6 1 - 0.3 V V A A V - - -0.3 0.7VDDI - - 0.7VDDI 0 0.7VDDI - Pin SCL (open-drain) LOW-level input voltage HIGH-level input voltage input leakage current +0.3VDDI 6 1 V V A Pin SIMERR (100 k pull-up resistor to VDDI) VOL VOH VIL VIH ILI Pin RST VO IO VOL VOH tf tr Pin CLK VO IO VOL VOH tf tr fclk output voltage output current LOW-level output voltage HIGH-level output voltage fall time rise time clock frequency duty factor inactive mode; IO = 1 mA -0.3 +0.4 -1 +0.3 8 8 1.5 10 55 V mA V ns ns MHz MHz % inactive mode; pin CLK short circuit - to ground IOL = 200 A IOH = -200 A CL = 30 pF CL = 30 pF 1 MHz power-down configuration regular activity CL = 30 pF -0.2 VCC - 0.5 - - 1 0 45 output voltage output current LOW-level output voltage HIGH-level output voltage fall time rise time inactive mode; IO = 1 mA -0.3 +0.4 -1 +0.3 0.5 0.5 V mA V s s inactive mode; pin RST short circuit - to ground IOL = 200 A IOH < -200 A CL = 30 pF CL = 30 pF -0.2 VCC - 0.5 - - LOW-level output voltage HIGH-level output voltage IOL < 1 mA IOH < -1 A 0.3VDDI - 0.3VDDI 1 V V Pins SAD0, SAD1 and PWROFF LOW-level input voltage HIGH-level input voltage input leakage current V A VDDI + 0.3 V VCC + 0.2 V VCC + 0.2 V 2000 Apr 20 15 Philips Semiconductors Product specification I2C-bus SIM card interface TDA8003TS SYMBOL Pin VCC VO PARAMETER CONDITIONS - MIN. TYP. - 5.10 3.05 MAX. UNIT output voltage inactive mode; IO = 1 mA active mode; 5 V card; no load active mode; 3 V card; no load active mode; with 200 nF capacitor; including static load (up to 20 mA) and dynamic current pulses; Imax = 200 mA, fmax = 5 MHz; duration <400 ns 5 V card; 40 nAs pulses 3 V card; 24 nAs pulses 0.4 5.40 3.22 V V V 4.85 2.8 4.60 2.75 - - - - 0.05 - - -0.2 0.8VCC -0.3 1.5 - - - - - - - - 0.17 - - - - - - - - - - - - - - 5.40 3.22 -1 15 40 120 0.25 V V mA mA mA mA V/s IO output current inactive mode; pin VCC short circuit to ground VCC = 5 or 3 V; VDD = 2.5 V VCC = 5 or 3 V; VDD = 5.5 V ICC SR Pin I/O VO IO VOL VOH VIL VIH ILIH IIL tt(DI) tt(DO) td Rpu(int) Pin SIMI/O VOL VOH VIL VIH ILIH output current VCC short circuit to ground slew rate on VCC (rise and fall) CL(max) = 300 nF output voltage output current LOW-level output voltage HIGH-level output voltage LOW-level input voltage HIGH-level input voltage HIGH-level input leakage current LOW-level input current data input transition time data output transition time delay time on falling edge internal pull-up resistance between pins I/O and VCC C1 version C2 version CL = 30 pF CL = 30 pF inactive mode; IO = 1 mA inactive mode; pin I/O short circuit to ground IOL = 1 mA +25 < IOH < -25 A 0.4 -1 +0.4 +0.8 10 -600 1 0.5 500 13 18 V mA V V A A s s ns k k VCC + 0.2 V VCC + 0.3 V - - - 8 13 -0.2 LOW-level output voltage HIGH-level output voltage LOW-level input voltage HIGH-level input voltage HIGH-level input leakage current IOL = 1 mA with internal 20 k pull-up resistor to VDDI; IO = 10 A +0.3 V VDDI - 0.3 - -0.3 0.7VDDI - - - - VDDI + 0.2 V +0.3VDDI 10 V A VDDI + 0.3 V 2000 Apr 20 16 Philips Semiconductors Product specification I2C-bus SIM card interface TDA8003TS SYMBOL IIL tt(DI) tt(DO) td Rpu(int) PARAMETER LOW-level input current data input transition time data output transition time delay time on falling edge internal pull-up resistance between pins SIMI/O and VDDI LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current CONDITIONS with internal 20 k pull-up resistor to VDDI; VI = 0 V CL = 30 pF CL = 30 pF - - - - 16 MIN. TYP. - - - - - MAX. -100 1 0.5 500 26 UNIT A s s ns k Pin PRES VIL VIH IIL IIH Timing tact tde activation time deactivation time - - - - 150 120 s s -0.3 0.7VDD - - - - - - +0.3VDD 5 -5 V A A VDD + 0.3 V 2000 Apr 20 17 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... andbook, full pagewidth MICROCONTROLLER 2000 Apr 20 3V 1.5 V 2.2 F CARD READER C4 C3 C2 C1 C5I C6I C7I C8I C8 C7 C6 C5 C1I C2I C3I C4I 100 nF 100 nF PWROFF S1 PGND S3 VDDP 100 nF S4 S2 100 nF VUP I/O SGND K1 (1) APPLICATION INFORMATION Philips Semiconductors I2C-bus SIM card interface +1.5 to +6 V 1.5 to 6 k 1.5 to 6 k 1 2 3 4 5 6 24 23 22 21 20 19 SIMCLK SAD1 SAD0 SIMERR SCL SDA VDDI SIMI/O PRES DEL VDDS RST 10 nF +1.5 V 100 nF +1.5 V VCC P0-0 P0-1 P0-2 P0-3 P0-4 P0-5 P0-6 P0-7 EA ALE PSEN P2-7 P2-6 P2-5 P2-4 P1-0 P1-1 P1-2 P1-3 P1-4 P1-5 P1-6 P1-7 RST P3-0 P3-1 P3-2 P3-3 P3-4 P3-5 P3-6 P3-7 XTAL2 XTAL1 VSS 14.74 MHz 10 F +1.5 V 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 TDA8003TS 7 8 9 10 11 12 18 17 16 15 14 13 18 K2 100 nF 3V 0 CLK VCC P2-3 100 nF 100 nF P2-2 P2-1 P2-0 3V 33 pF MGR440 33 pF TDA8003TS Product specification (1) The switch is normally closed when the card is not present. Fig.7 Application diagram. Philips Semiconductors Product specification I2C-bus SIM card interface PACKAGE OUTLINE SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm TDA8003TS SOT340-1 D E A X c y HE vMA Z 24 13 Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 12 wM detail X A 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 8.4 8.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.8 0.4 8 0o o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC MO-150 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 99-12-27 2000 Apr 20 19 Philips Semiconductors Product specification I2C-bus SIM card interface SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering TDA8003TS If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 2000 Apr 20 20 Philips Semiconductors Product specification I2C-bus SIM card interface Suitability of surface mount IC packages for wave and reflow soldering methods TDA8003TS SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable 2000 Apr 20 21 Philips Semiconductors Product specification I2C-bus SIM card interface DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1) TDA8003TS This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Preliminary specification Qualification Product specification Production Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. PURCHASE OF PHILIPS I2C COMPONENTS DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 2000 Apr 20 22 Philips Semiconductors Product specification I2C-bus SIM card interface NOTES TDA8003TS 2000 Apr 20 23 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000 Internet: http://www.semiconductors.philips.com SCA 69 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753504/03/pp24 Date of release: 2000 Apr 20 Document order number: 9397 750 07034 |
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